TwitterFacebookGoogle PlusLinkedIn

Contact Us! +1-970-493-1901 sales@ixyscolorado.com

Product Change & Discontinuation Notices Files

PCN-121115-002 Relocation of gate bond wires

  • Version: V3
  • Relocation of gate bond wires on DE-Series (DE-150, DE-275, DE-275X2, DE-375 and DE-475 series), and ZMOS IXZ2 and IXZ3 series devices, from the Lead Frame to the DCB substrate.